The EP1C12F256C6 by Intel falls within the highly esteemed Cyclone® FPGA series, renowned for delivering robust flexibility and performance. Structured with a sophisticated architecture, this FPGA features 12,060 logic elements and 1,206 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), offering a substantial base for intricate design implementations. It has been encapsulated in a 256-ball Fine-Pitch Ball Grid Array (FBGA) packaging, optimized for surface mount technology, ensuring a compact footprint with a package size of 256-FBGA (17×17).

Designed to operate within a temperature range of 0°C to 85°C (TJ), the EP1C12F256C6 demonstrates resilience in various environmental conditions, making it a viable choice for applications across a myriad of industries, including but not limited to telecommunications, automotive, consumer electronics, and industrial automation. The device boasts a considerable I/O count of 185, coupled with a total RAM bit count of 239,616, providing ample resources for high-density logic integration and data storage capabilities.

Although marked obsolete, its legacy in powering critical applications and its specification-rich framework render it still sought after for specific legacy systems or specialty projects where compatibility and proven performance are paramount. The EP1C12F256C6 remains a testament to Intel’s commitment to innovation and excellence in the FPGA domain, offering designers a robust platform for developing advanced electronic systems.