The A3P1000-FGG484M is a part of Microchip Technology’s ProASIC3 FPGA series, a leading-edge category known for its non-volatile, low power FPGAs. This specific model is housed in a 484-Ball Fine-Pitch Ball Grid Array (FPBGA) package with dimensions of 23×23 mm, optimized for surface mount applications. The device operates over a wide temperature range from -55°C to 125°C (TJ), making it viable for use in extreme conditions, a feature highly appreciated in aerospace, defense, and industrial applications where reliability under temperature variation is crucial.

Supporting a total RAM bit count of 147456 and equipped with 300 I/O pins, the A3P1000-FGG484M provides a substantial capacity for managing complex digital computations and high-speed interfacing. These technical specifications cater well to the needs of advanced communication systems, consumer electronics, and automotive safety devices, among other high-tech industries.

The FPGA is currently classified as active, ensuring availability and support for ongoing and future projects. The device’s robust packaging form in a tray facilitates efficient handling and integration into manufacturing processes. This FPGA by Microchip Technology stands out for its blend of high performance, reliability, and versatility, fitting seamlessly into sophisticated electronic environments demanding high-speed data processing and precise control.