Analog Devices Amplifiers
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Produced by renowned manufacturer Intel, the Stratix® V GX FPGA, with part number 5SGXMA4H2F35I2LG, is an exceptional component in the realm of Field Programmable Gate Arrays. This active-status model is offered in 1152-BBGA, FCBGA package, and is uniquely presented in a tray packaging format. This product appreciably caters to surface mounting applications and can operate in a dynamic temperature range of -40°C ~ 100°C (TJ).
The framework harbors a noble count of 420,000 logic elements or cells that significantly enhance its computing potential. The device’s housing encases 158,500 Logic Array Blocks (LABs) or Configurable Logic Blocks (CLBs). Moreover, the part encapsulates an impressive number of total RAM bits standing at 37,888,000, which significantly upgrades its data handling capacity.
Possessing a total of 600 input/output pins, the Stratix® V GX FPGA augments the rate of signal transmission and increases the scope for system integrations. The device’s standard supplier device package configuration is 1152-FBGA (35×35).
Predominantly used in sectors that demand high-volume data computations and low-latency data transmissions, such as telecommunications, network infrastructure, and data centers, Intel’s Stratix® V GX series FPGA, part number 5SGXMA4H2F35I2LG, is technologically equipped to handle complex system requirements with utmost efficiency.
Datasheet:
Not Available
Download Free CAD Model:
Packaging | Tray |
Package / Case | 1152-BBGA, FCBGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 0.82V ~ 0.88V |
Number of Logic Elements/Cells | 420000 |
Supplier Device Package | 1152-FBGA (35x35) |
Number of LABs/CLBs | 158500 |
Total RAM Bits | 37888000 |
Part Status | Active |
Number of I/O | 600 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
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TSSOP / 16 / 5X4MM-0
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