The 5SGSMD3E3H29I3LG from Intel is an FPGA (Field Programmable Gate Array) from the Stratix® V GS series. This high-level technology is incorporated into a 780-BBGA, FCBGA type of package with the added convenience of tray packaging. The surface-mount design allows for simple application. Notably, it operates efficiently over a broad temperature range from -40°C up to 100°C (TJ).

This components features an impressive number of Logic Elements/Cells, coming in at 236,000. Correspondingly, the number of LABs/CLBs is also substantial at 89,000, which is a testament to the device’s high-level integration. Additionally, the total RAM bits capacity of 13,312,000 showcases its strong data management capabilities.

An active part, the 5SGSMD3E3H29I3LG has a leading 360 I/O count. Fittingly, it is supplied in a 780-HBGA (33×33) package. With these specifications, it is ideal for comprehensive computing solutions and sophisticated data processing tasks.

It’s important to note that this semiconductor part is a fitting choice for multiple industries, such as telecommunication, data centres, and other specialized applications where top-notch computing performance is a critical requirement. As an integral part of Intel’s Stratix® V GS series, this component brings esteemed quality and reliable performance to the table.