Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The 5CGXFC4C6F23I7N from Intel is a high-performance component belonging to the Cyclone® V GX series of Field Programmable Gate Arrays (FPGAs). This active part, known for its advanced functionality, comprises an impressive 50,000 logic elements/cells, providing a formidable computational capacity.
Being housed in a 484-BGA package, the device is designed with surface mount technology, associated with optimal performance, stability, and long-term reliability. The supplier device package comes in the 484-FBGA (23×23) format, suitable for high-count packages.
In terms of input and output capacity, the FPGA offers a large number of I/O -240, thereby enhancing its interconnectivity and overall versatility. It also boasts a total of 2862080 RAM bits, which is an indicator of its substantial storage capability.
The device operates efficiently within a temperature range of -40°C to 100°C (TJ), accommodating a broad range of environmental conditions, and making it suitable for various applications across different industries. With a sizeable figure of 18868 LABs/CLBs, it further underscores its high-level processing capability.
The 5CGXFC4C6F23I7N is supplied in a tray package, a common packaging format for such devices, and maintains easy installation and handling during the assembly process. Intel’s Cyclone® V GX series represents a new generation of programmable logic devices, renowned for delivering cost-effective and power-efficient solutions, along with robust security features.
The FPGA device finds extensive applications in a range of industry domains, like the data center, enterprise, automotive, industrial, and Internet of Things (IoT) disciplines, where high-performance processing power is an essential requirement.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 484-BGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 1.07V ~ 1.13V |
Number of Logic Elements/Cells | 50000 |
Supplier Device Package | 484-FBGA (23x23) |
Number of LABs/CLBs | 18868 |
Total RAM Bits | 2862080 |
Part Status | Active |
Number of I/O | 240 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
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