The 10M08DFV81I7G, crafted by Intel, belongs to the powerful MAX® 10 series of field-programmable gate arrays (FPGAs). Provided in tape and reel packaging, this FPGA features an 81-UFBGA, WLCSP package that promotes surface mounting. Its Build-in Picture (BIP) technology advancement allows for optimum functionality across a broad temperature range (-40°C to 100°C).

The 10M08DFV81I7G is developed to house a staggering 8000 logic elements or cells, presenting advanced possibilities for customization. The Supplier Device Package being an 81-VBGA, WLCSP (4.5×4.4) further bolsters its versatility and durability, especially in applications that call for high-speed digital connections.

This FPGA delivers a robust count of 500 LABs or CLBs, offering more flexibility and scalability in design and function. Furthermore, it boasts a total of 387072 RAM bits, ensuring sufficient data storage and exemplary performance in data handling operations.

The part is designated as active, indicating its readiness for immediate shipment and integration into various circuits. It is capable of providing up to 56 inputs/outputs, broadening its potential implementation in various high-demand industries.

The 10M08DFV81I7G, with its extensive figure of logic cells and LABs, coupled with wide operating temperature range and substantial RAM bits, places this FPGA from Intel’s MAX® 10 series as a high-performing, versatile solution for digital applications, secure connected systems, machine learning, and more.