The DS21554L from Analog Devices Inc. is a highly integrated, single-chip solution tailored for the demanding requirements of the telecom industry. As part of their extensive telecom product line, this component is encapsulated in a 100-LQFP package, ensuring its robustness for surface mount technology (SMT) assemblies. Measuring 14×14, the package is designed to optimize the balance between board space efficiency and operational reliability.

With an operational temperature range of 0°C to 70°C, the DS21554L offers flexibility for various environmental conditions, ensuring consistent performance in a wide range of applications. The part is currently in an active status, indicating ongoing production and availability, which is essential for project timelines and lifecycle planning.

The DS21554L’s architecture is housed in a tray packaging format, facilitating efficient handling and integration into manufacturing workflows. This component is pivotal for the development of telecommunications infrastructure, serving as a foundational element in systems requiring precise and reliable data management and transmission.

Given its design specificity for telecom applications, the DS21554L represents a key element in building robust communication networks. This makes it a valuable component for professionals and organizations involved in the expansion and maintenance of telecommunication systems, including but not limited to mobile networks, data transmission services, and broadband connectivity solutions.