The DS21552L from Analog Devices Inc. falls within the telecom category, reflecting its specific application in telecommunications equipment. This component is packaged in trays, with each piece designed for surface-mount technology (SMT), facilitating streamlined assembly processes on printed circuit boards (PCBs). With a 100-LQFP (Low Quad Flat Package), the dimensions are standardized at 14×14, ensuring compatibility with a wide range of telecom hardware designs.

Operating within a temperature range of 0°C to 70°C, the DS21552L is engineered to withstand the thermal rigors of intensive telecom operations, maintaining performance and reliability in varied environmental conditions. This adaptability underscores its suitability for deployment in telecommunications infrastructure, where consistent operation is critical.

In terms of its form factor, the 100-LQFP casing of the DS21552L minimizes space usage on the PCB, a crucial feature for telecom equipment designers seeking to optimize the economy of space without compromising on functionality.

Although designated as “Not For New Designs,” this label indicates that while the DS21552L may not be recommended for upcoming projects seeking the latest technology, it remains a vital component for maintenance, repair, and operational continuity of existing telecom systems globally. Its continued usage underscores the importance of legacy systems in the telecommunications industry, where stability and reliability are paramount.