Samsung Shows 3D AI Chip Packaging Tech to Rival TSMC

Samsung Electronics Co., the world’s largest memory chipmaker, is preparing to launch an advanced 3D chip packaging technology called SAINT (Samsung Advanced Interconnection Technology.) The goal is to compete with Taiwan Semiconductor Manufacturing Company (SMC), the leader in foundry services. SAINT technology enables the merging memory and processors required for high-performance chips, including AI chips,…

The 3 potential semiconductor hubs that are in Japan

In today’s rapidly changing geopolitical landscape, countries around the world are actively working towards establishing self-reliant semiconductor supply chains and strengthening their industrial resilience. Taiwan has emerged as a dominant force in semiconductor foundries, capturing a remarkable 65% market share in global foundry revenue, with Taiwan Semiconductor Manufacturing Co. (TSMC) alone commanding a significant 56%.…

GlobalFoundries Secures $35M Federal Funding to Revolutionize 5G and 6G with GaN Chips

GlobalFoundries has received $35 million in federal funding from the U.S. government. This funding will accelerate the production of GF’s gallium nitride (GaN) on silicon semiconductors in Vermont, taking us one step closer to large-scale production of GaN chips. GaN chips have the potential to transform 5G and 6G communications in various industries, including infrastructure,…

GlobalFoundries Announces Plans to Expand U.S. Chip Manufacturing with CHIPS Act Funds

GlobalFoundries fab in Dresden. (Image source: Wiki Images.) GlobalFoundries, a leading semiconductor chip manufacturer, is seeking federal funding to enhance its ability to produce semiconductors and modernize its facilities in the U.S., including their property in Malta. The company has applied to participate in the federal grants and investment tax credits made available through the…