The AMD XCZU9EG-2FFVB1156I is a highly sophisticated System On Chip (SoC) from the cutting-edge Zynq® UltraScale+™ MPSoC EG series, designed to deliver superior performance for a wide range of high-end applications. This component is encapsulated in a 1156-BBGA, FCBGA package, ensuring robust physical protection and reliable connectivity in demanding environments. Its operational temperature range of -40°C to 100°C (TJ) makes it a versatile choice for projects requiring durability under extreme conditions.

Engineered with precision, the device is provided in a tray packaging format and features a 1156-FCBGA (35×35) supplier device package, making it suitable for intricate system integration with ease of assembly. As an active component, the XCZU9EG-2FFVB1156I continues to be a premier choice for developers and engineers looking to harness the power of the Zynq® UltraScale+™ MPSoC EG series for their projects.

Key aspects of the XCZU9EG-2FFVB1156I include:

– Manufacturer: AMD
– Category: System On Chip (SoC) from the Zynq® UltraScale+™ MPSoC EG series
– Packaging in tray for secure and efficient handling
– Package / Case: 1156-BBGA, FCBGA offering excellent reliability
– Operating Temperature: Extensively ranges from -40°C to 100°C (TJ) for high adaptability
– Supplier Device Package: 1156-FCBGA (35×35) for efficient integration

Industries that widely utilize this component include aerospace, defense, automotive, and high-performance computing, showcasing its ability to serve in the most demanding technological applications. The AMD XCZU9EG-2FFVB1156I sets an industry benchmark for SoCs, delivering unmatched versatility, power, and efficiency critical for modern technological innovations.