The AMD XCZU15EG-L1FFVB1156I is a high-performance System on Chip (SoC) from the Zynq® UltraScale+™ MPSoC EG series, meticulously designed to meet the demanding requirements of advanced embedded applications. Crafted in a 1156-BBGA, FCBGA package, this SoC stands out for its robust packaging and efficient heat dissipation characteristics, making it an ideal choice for operations within a broad temperature range of -40°C to +100°C (TJ).

This product integrates a multifaceted architecture that combines the processing power of ARM® Cortex processors with the flexibility of FPGA (Field Programmable Gate Array) technology, providing unparalleled versatility and computing performance. The XCZU15EG-L1FFVB1156I is offered in a 1156-FCBGA (35×35) supplier device package, ensuring compatibility with a wide range of PCB designs and facilitating the integration process for system developers.

Notable for its active part status, this SoC is positioned to support the innovation and development needs within various industries, including but not limited to telecommunications, automotive, defense, and aerospace. Its advanced features offer sophisticated solutions for complex system requirements, delivering both processing power and energy efficiency.

Key Features:
– Part of the Zynq® UltraScale+™ MPSoC EG series
– Housed in a reliable 1156-BBGA, FCBGA package
– Operates across a wide temperature range: -40°C to +100°C (TJ)
– Features ARM® Cortex processors combined with FPGA technology
– Supplied in a 1156-FCBGA (35×35) package
– Active part status ensures ongoing support and availability

The AMD XCZU15EG-L1FFVB1156I SoC is engineered to support the next generation of embedded design, offering a sophisticated blend of power, flexibility, and reliability for system developers working in cutting-edge technological fields.