The XCZU15EG-2FFVB1156I by AMD is a high-performance System on Chip (SoC) designed under the Zynq® UltraScale+™ MPSoC EG series. It is meticulously engineered for advanced processing needs, leveraging the robust capabilities of the UltraScale+ architecture. This SoC merges the flexibility of FPGA programmability with the efficiency and speed of hardware processing, creating an optimal platform for complex, computation-intensive applications.

Features and Specifications:
– **Manufacturer**: AMD
– **Category**: System On Chip (SoC)
– **Series**: Zynq® UltraScale+™ MPSoC EG
– **Packaging**: Tray, ensuring safe and secure handling during shipping and assembly.
– **Package/Case**: 1156-BBGA, FCBGA, offering a compact and reliable footprint for high-density board designs.
– **Operating Temperature Range**: -40°C ~ 100°C (TJ), allowing operation in a wide range of environmental conditions.
– **Supplier Device Package**: 1156-FCBGA (35×35), optimized for enhanced thermal and signal integrity.
– **Part Status**: Active, confirming its availability and ongoing support for production.

This component is widely utilized in industries that demand high-level processing power and efficiency, including but not limited to telecommunications, aerospace and defense, automotive systems, and advanced multimedia devices. Its integration enables designers to leverage this powerful SoC for developing applications that require significant data processing, machine learning capabilities, and real-time operations, ensuring they stay at the forefront of technology advancements.

The XCZU15EG-2FFVB1156I represents a remarkable blend of AMD’s prowess in semiconductor design, offering unparalleled processing capabilities that cater to the ever-growing demands of modern technology infrastructure.