The AMD XCZU15EG-1FFVB1156I is a cutting-edge System On Chip (SoC) from the esteemed Zynq® UltraScale+™ MPSoC EG series, designed to propel applications requiring high processing power and efficiency. This component features a highly integrated design that combines advanced processing units with FPGA logic, making it ideal for a wide range of applications across various industries, including telecommunications, automotive, defense, and aerospace, among others.

Key specifications of the AMD XCZU15EG-1FFVB1156I include:

– **Package / Case**: It is encapsulated in a 1156-BBGA, FCBGA package, ensuring robust performance and reliability in demanding environments.
– **Operating Temperature**: Engineered for resilience, it operates within a temperature range of -40°C to 100°C (TJ), accommodating the rigorous conditions of industrial applications.
– **Supplier Device Package**: Supplied in a 1156-FCBGA (35×35) package, it offers a compact footprint without compromising on the processing power.
– **Active Status**: Confirms that the component is currently in production, ensuring availability for new designs and replacements.
– **Packaging**: Delivered in a tray format, facilitating safe handling and shipping.

This SoC is a pivotal choice for developers and engineers looking to integrate a high level of computational power and efficiency into their designs, offering a versatile solution that combines the programmable logic of an FPGA with the software programmability of a high-performance ARM® processor. The integration of these features within a single chip offers a powerful yet flexible platform, enabling optimized and application-specific configurations that can significantly reduce time-to-market for complex projects.