The AMD XC7Z045-3FFG900E is a high-performance System On Chip (SoC) from the renowned Zynq®-7000 series. This component is skillfully crafted in a 900-Ball Fine-Pitch Ball Grid Array (FCBGA) package, ensuring a compact and reliable integration into a wide range of applications. With dimensions defined as 900-FCBGA (31×31), this SoC offers a powerful blend of ARM® Cortex®-A9 processor with FPGA capabilities, making it an ideal choice for advanced embedded systems.

Operating within a temperature range of 0°C to 100°C (TJ), the XC7Z045-3FFG900E guarantees robust performance even under demanding conditions, catering to the needs of sectors requiring high reliability and precision. The part is provided in tray packaging, ensuring secure and safe delivery for high-quality assembly processes.

Active status of this part signifies ongoing manufacturer support and availability, making it a trustable choice for long-term projects. Embedded professionals will find this component especially useful in developing solutions for industries such as telecommunications, automotive, defense, and aerospace, where its ability to support intricate digital signal processing and control tasks stands out.

The integration of dual ARM Cortex-A9 MPCore™ with CoreSight™ and advanced programmable logic elements provides a versatile platform for hardware and software designers to innovate. This SoC is not only about powerful computing capabilities but also about enabling the development of highly customizable, scalable solutions that meet the evolving demands of technology landscapes.