The XC7Z035-1FFG676C, a high-performance System On Chip (SoC) from AMD’s renowned Zynq®-7000 series, stands out within the market for its exceptional integration of a dual ARM® Cortex™-A9 processor with FPGA technology. Enclosed in a 676-BBGA, FCBGA package, this SoC delivers on the promise of a highly flexible and scalable processing platform, suitable for advanced applications across a variety of industries such as telecommunications, automotive, defense, and aerospace. Its operational temperature range from 0°C to 85°C (TJ) ensures reliability under a broad spectrum of environmental conditions.

This specific component is provided in a tray packaging format, underlining its readiness for volume integration into manufacturing and development processes. With the supplier device package being a 676-FCBGA (27×27), it is tailored for efficient layout on printed circuit boards, allowing for dense integration without sacrificing performance.

As an active part of the Zynq®-7000 family, the XC7Z035-1FFG676C exemplifies the series’ capabilities in merging the software programmability of an ARM-based processor with the hardware programmability of an FPGA, thus offering a versatile and powerful solution for complex embedded systems. This combination facilitates the development of highly customizable platforms able to meet the specific needs of a project, from signal processing and image recognition to industrial automation and control systems, leveraging the dual strengths of processing power and programmable logic.