The AMD XC7Z035-1FBG676I is a high-performance System On Chip (SoC) from the Zynq®-7000 series, designed to meet the sophisticated needs of advanced applications. Encased in a 676-BBGA, FCBGA package, this SoC integrates a dual ARM® Cortex®-A9 MPCore™ with advanced 28nm process technology, offering significant processing power and efficiency for embedded applications.

With an operating temperature range of -40°C to 100°C (TJ), the XC7Z035-1FBG676I is engineered for reliability and durability in harsh environments, making it well-suited for industrial, aerospace, defense, and high-performance computing applications. This SoC is presented in a supplier device package of 676-FCBGA (27×27), confidently affirming its robustness and suitability for high-density integrated solutions.

A distinctive feature of the Zynq®-7000 series, and particularly of the XC7Z035-1FBG676I, is its seamless integration of software programmability with hardware optimization, allowing for flexible and scalable designs that can meet varying customer demands without the cost and time associated with traditional ASIC (Application-Specific Integrated Circuit) or SoC development cycles.

This component’s active part status indicates its ongoing production and availability for new designs, providing system designers with a reliable and future-proof option that leverages the cutting-edge technological advancements offered by AMD. Whether developing next-generation avionics systems, IoT devices, or advanced communication platforms, the XC7Z035-1FBG676I offers a compelling solution that combines processing power, flexibility, and ruggedness.