The XC7Z020-2CLG400E, crafted by AMD, stands as a premier component within the Zynq®-7000 series, tailored for advanced System On Chip (SoC) applications. This particular part, encapsulated in a 400-LFBGA, CSPBGA package, is designed to accommodate a broad spectrum of operating temperatures ranging from 0°C to 100°C (TJ), ensuring reliability and performance across various environmental conditions. With its architecture housed in a 400-CSPBGA (17×17) supplier device package, it boasts an active status, highlighting its relevance and demand in the current market.

The Zynq®-7000 series integrates a powerful ARM® Cortex™-A9 processor with Xilinx 7-series Field Programmable Gate Array (FPGA) logic, enabling unprecedented levels of programmable system integration. This synergy allows the XC7Z020-2CLG400E to offer unparalleled versatility, making it an ideal solution for implementing complex systems on a single chip across diverse industries such as telecommunications, automotive, defense, and consumer electronics. The comprehensive integration capabilities facilitate not only a reduction in power consumption but also an efficient, compact design footprint, streamlining the development process for high-performance, embedded applications.

Its packaging in a tray format caters to the efficient handling and assembly processes, ensuring that the component remains protected during transportation and storage. The XC7Z020-2CLG400E represents a significant leap forward in SoC technology, providing the robustness, efficiency, and flexibility demanded by cutting-edge applications and complex system designs.