The XC7Z010-3CLG400E, manufactured by AMD, is a part of the high-performance Zynq®-7000 series, positioned under the System On Chip (SoC) category. It comes in a 400-LFBGA (CSPBGA) package type, ensuring robust physical integration into a wide array of computing and control systems. This particular model is offered in a tray packaging format to facilitate secure handling and shipping.

With an operating temperature range from 0°C to 100°C (TJ), this SoC is engineered to meet the stringent reliability demands of a broad spectrum of industrial applications. The component utilizes a 400-CSPBGA (17×17) supplier device package, emblematic of its compactness and efficiency in space-constrained environments.

The XC7Z010-3CLG400E remains an active part in AMD’s product line, underscoring its sustained relevance and reliability across various use cases. This SoC is integral in powering solutions across sectors that demand high performance and reliability. These sectors often encompass telecommunications, automotive industries, consumer electronics, and aerospace applications, where the blend of processing power, and low-power consumption defines the core requirements.

AMD’s Zynq®-7000 series epitomizes a leap in processing capabilities, combining the flexibility of a programmable logic architecture with the power of a processing system. This integration makes the XC7Z010-3CLG400E a cornerstone in the development and deployment of complex digital systems requiring adaptable, high-throughput, and energy-efficient processing units. The strategic design and technological prowess of this SoC offer developers an unparalleled platform for innovation across critical and demanding applications.