You are here:
  1. Home
  2. Shop
  3. System On Chip (SoC)
  4. 5CSXFC5C6U23A7N
  • 5CSXFC5C6U23A7N

5CSXFC5C6U23A7N

IC SOC CORTEX-A9 700MHZ 672UBGA

Manufacturer:

$399.75

Categories:

The 5CSXFC5C6U23A7N is a high-performance System on Chip (SoC) component from renowned manufacturer Intel. This particular component is part of Intel’s specialized Automotive, AEC-Q100, Cyclone® V SE series, renowned for its exceptional performance, flexibility, and power efficiency. Ideal for fitting into compact form factors, this SoC comes encased in a robust 672-FBGA package.

Furthermore, this component features a supplier device package of 672-UBGA (23×23), enhancing its compatibility and physical interfacing flexibility. The packaging method for this item is Tray, aiding in the secure and efficient storage and transport of the product. Its active part status reflects its reliability and relevant use in present applications.

The 5CSXFC5C6U23A7N was built to endure harsh environments and wide temperature variations, expertly handling temperatures ranging from -40°C up to 125°C (TJ). This temperature resilience makes it an ideal component for applications in the automotive sector, where sudden temperature changes are common.

Overall, this SoC from Intel, marked by its high operational standards and broad temperature range, is particularly suited for more demanding applications in the automotive industry, which typically require robust, reliable components capable of withstanding challenging environments.

Additional information

Additional Information

Series: Automotive, AEC-Q100, Cyclone® V SE
RoHS Status: RoHS Compliant
Manufacturer Lead Time: No lead time information available
Product Status: Active
Packaging: Tray

Datasheet:

Download Free CAD Model:

Technical Details:
PackagingTray
Package / Case672-FBGA
Speed700MHz
RAM Size64KB
Operating Temperature-40°C ~ 125°C (TJ)
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary AttributesFPGA - 85K Logic Elements
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, POR, WDT
Supplier Device Package672-UBGA (23x23)
ArchitectureMCU, FPGA
Flash Size-
Part StatusActive
[{‘ParameterId’: 7, ‘ValueId’: ’17’, ‘Parameter’: ‘Packaging’, ‘Value’: ‘Tray’}, {‘ParameterId’: 16, ‘ValueId’: ‘264292’, ‘Parameter’: ‘Package / Case’, ‘Value’: ‘672-FBGA’}, {‘ParameterId’: 143, ‘ValueId’: ‘273011’, ‘Parameter’: ‘Speed’, ‘Value’: ‘700MHz’}, {‘ParameterId’: 156, ‘ValueId’: ‘261538’, ‘Parameter’: ‘RAM Size’, ‘Value’: ’64KB’}, {‘ParameterId’: 252, ‘ValueId’: ‘212481’, ‘Parameter’: ‘Operating Temperature’, ‘Value’: ‘-40°C ~ 125°C (TJ)’}, {‘ParameterId’: 506, ‘ValueId’: ‘341791’, ‘Parameter’: ‘Core Processor’, ‘Value’: ‘Dual ARM® Cortex®-A9 MPCore™ with CoreSight™’}, {‘ParameterId’: 1018, ‘ValueId’: ‘349117’, ‘Parameter’: ‘Primary Attributes’, ‘Value’: ‘FPGA – 85K Logic Elements’}, {‘ParameterId’: 1113, ‘ValueId’: ‘326026’, ‘Parameter’: ‘Connectivity’, ‘Value’: ‘CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG’}, {‘ParameterId’: 1114, ‘ValueId’: ‘339872’, ‘Parameter’: ‘Peripherals’, ‘Value’: ‘DMA, POR, WDT’}, {‘ParameterId’: 1291, ‘ValueId’: ‘264311’, ‘Parameter’: ‘Supplier Device Package’, ‘Value’: ‘672-UBGA (23×23)’}, {‘ParameterId’: 1523, ‘ValueId’: ‘374387’, ‘Parameter’: ‘Architecture’, ‘Value’: ‘MCU, FPGA’}, {‘ParameterId’: 1621, ‘ValueId’: ‘1’, ‘Parameter’: ‘Flash Size’, ‘Value’: ‘-‘}, {‘ParameterId’: 1989, ‘ValueId’: ‘0’, ‘Parameter’: ‘Part Status’, ‘Value’: ‘Active’}]

Request a Quote

Virtex UltraScale+

,

Xilinx’s Virtex UltraScale+ platform is shaping the future of high-performance computing. This cutting-edge field-programmable gate array (FPGA) technology enables rapid innovation in emerging applications requiring…

Read more