The 5CSTFD6D5F31I7N is an in-demand System On Chip (SoC) component, proudly manufactured by Intel. As an integral part of the Cyclone® V ST series, this particular piece has established itself as an industry-standard in various high-tech sectors. This part is highly notable due to its robust package and case, the 896-BGA, ensuring solid performance and durability. The 5CSTFD6D5F31I7N was designed to withstand a wide range of operating temperature from -40°C to 100°C, emphasizing its suitability for diverse demanding environments. Furthermore, the 896-FBGA (31×31) supplier device package is an additional testament to the product’s functionality and impressive specifications. With its active part status, this component is frequently utilized, satisfying a plethora of user requirements. Intel, a global leader in semiconductors’ manufacture, guarantees reliable performance and outstanding quality of the 5CSTFD6D5F31I7N. Its tray packaging ensures the product is appropriately protected during transit, ensuring it reaches end users in optimal condition, making it primed for installation upon arrival. This intricate SoC component underscores the unmatched capability and innovativeness that goes into the production of items within the respected Cyclone® V ST series. These chips are often used in a wide array of industries such as telecommunications, robotics, and consumer electronics, among others, due to their excellent adaptability and proven performance.