The Intel 5CSEMA6U23I7N stands as a comprehensive system on chip (SoC) component hailing from the robust Cyclone® V SE series. This SoC is renowned for its high functionality, sporting a powerful 672-FBGA package/case. Housed in this advanced package, the chip has a generous operating temperature capacity ranging from -40°C to 100° C (TJ).

Intel has packaged the 5CSEMA6U23I7N in a tray, a testament to its quality and the manufacturer’s commitment to protect the component until deployment. Further, the supplier device package leverages 672-UBGA configuration in a compact 23×23 format, providing proof of the chip’s intricate power-to-space ratio.

As a product with an active part status, it reaffirms the continued production and availability of this SoC. The Intel 5CSEMA6U23I7N’s adaptability and power underline its frequent use in multiple sectors, notably telecommunications, automotive technologies, and sophisticated AI processing.

This SoC, by virtue of belonging to the Cyclone® V SE series, delivers high performance, low power consumption, and unparalleled system integration, including a wealth of resources that complement power and cost savings. Taking into consideration its technical attributes, the 5CSEMA6U23I7N showcases Intel’s prowess in crafting top-grade, versatile system on chip components integral to a myriad of complex and high-powered systems across industries.