The 5CSEMA6U23C7N is an active System On Chip (SoC) component expertly manufactured by Intel, a renowned manufacturer in the semiconductor industry. Hailing from the Cyclone® V SE Series, this device offers reliable performance and is packaged in a tray for safe transport and handling.

The chip is housed in a 672-FBGA (Fine-Pitch Ball Grid Array) package, signifying its advanced integrated circuit that can accommodate a high number of pins in a compact size. The Supplier Device Package references a 672-UBGA (Ultra Ball Grid Array- 23×23), showcasing a commitment to dense, high-speed interconnections. This level of high-density interconnect technology makes this SoC ideal for sophisticated functionalities and high-performance computing applications.

The operational temperature range for the 5CSEMA6U23C7N is 0°C to 85°C (Junction Temperature), which ensures its stable operation in a variety of environments. This remarkable temperature tolerance adds to the device’s reliability in several industrial applications, including aerospace, consumer electronics, and communication or networking devices where varying temperature ranges are common.

The 5CSEMA6U23C7N represents Intel’s commitment to advanced semiconductor technology and serves as proof of the company’s ability to keep up with the ever-accelerating pace of the digital world. With Intel’s history of innovation and proven product reliability, this SoC is a reliable choice for optimizing performance in complex electronic applications and systems.