You are here:

5CSEMA6U23A7N

IC SOC CORTEX-A9 700MHZ 672UBGA

Manufacturer:

$429.62

Categories:

The 5CSEMA6U23A7N is a high-performing System On Chip (SoC) manufactured by Intel. As a part of the Automotive, AEC-Q100, Cyclone® V SE Series, it is characterized by its exceptional versatility and robustness, making it suitable for a wide range of demanding applications within the automotive and industrial environments.

The SoC comes in a 672-FBGA package with a tray packaging style, making it easy for sorting and handling during assembly while also providing excellent thermal and electrical performance. The supplier device package is 672-UBGA (23×23), providing an excellent contact quality and package robustness.

Operating temperature ranges from -40°C up to 125°C (TJ), allowing this component to function optimally under varying environmental conditions. This offers an added benefit for applications operating in temperature critical situations or those subject to a broad range of operating temperatures.

The 5CSEMA6U23A7N is currently active in our inventory, ensuring availability for immediate builds and designs. This SoC component has been crafted with excellence and precision, guaranteeing performance that matches the high standards set by Intel, a leader in semiconductor technology.

This component is typically used in the automotive industry due to its compliance with AEC-Q100 standards, reflecting its ability to withstand the rigors of an automotive environment. It can also find applications in sectors such as robotics, AV systems, or networking due to its optimal performance, durability, and heat resistance. The Cyclone V SE series represents the perfect marriage between high performance and power efficiency, marking this component as a premier choice for sophisticated electronic design applications.

Additional information

Additional Information

Series: Automotive, AEC-Q100, Cyclone® V SE
RoHS Status: RoHS Compliant
Manufacturer Lead Time: No lead time information available
Product Status: Active
Packaging: Tray

Datasheet:

Download Free CAD Model:

Technical Details:
PackagingTray
Package / Case672-FBGA
Speed700MHz
RAM Size64KB
Operating Temperature-40°C ~ 125°C (TJ)
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary AttributesFPGA - 110K Logic Elements
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, POR, WDT
Supplier Device Package672-UBGA (23x23)
ArchitectureMCU, FPGA
Flash Size-
Part StatusActive
[{‘ParameterId’: 7, ‘ValueId’: ’17’, ‘Parameter’: ‘Packaging’, ‘Value’: ‘Tray’}, {‘ParameterId’: 16, ‘ValueId’: ‘264292’, ‘Parameter’: ‘Package / Case’, ‘Value’: ‘672-FBGA’}, {‘ParameterId’: 143, ‘ValueId’: ‘273011’, ‘Parameter’: ‘Speed’, ‘Value’: ‘700MHz’}, {‘ParameterId’: 156, ‘ValueId’: ‘261538’, ‘Parameter’: ‘RAM Size’, ‘Value’: ’64KB’}, {‘ParameterId’: 252, ‘ValueId’: ‘212481’, ‘Parameter’: ‘Operating Temperature’, ‘Value’: ‘-40°C ~ 125°C (TJ)’}, {‘ParameterId’: 506, ‘ValueId’: ‘341791’, ‘Parameter’: ‘Core Processor’, ‘Value’: ‘Dual ARM® Cortex®-A9 MPCore™ with CoreSight™’}, {‘ParameterId’: 1018, ‘ValueId’: ‘349098’, ‘Parameter’: ‘Primary Attributes’, ‘Value’: ‘FPGA – 110K Logic Elements’}, {‘ParameterId’: 1113, ‘ValueId’: ‘326026’, ‘Parameter’: ‘Connectivity’, ‘Value’: ‘CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG’}, {‘ParameterId’: 1114, ‘ValueId’: ‘339872’, ‘Parameter’: ‘Peripherals’, ‘Value’: ‘DMA, POR, WDT’}, {‘ParameterId’: 1291, ‘ValueId’: ‘264311’, ‘Parameter’: ‘Supplier Device Package’, ‘Value’: ‘672-UBGA (23×23)’}, {‘ParameterId’: 1523, ‘ValueId’: ‘374387’, ‘Parameter’: ‘Architecture’, ‘Value’: ‘MCU, FPGA’}, {‘ParameterId’: 1621, ‘ValueId’: ‘1’, ‘Parameter’: ‘Flash Size’, ‘Value’: ‘-‘}, {‘ParameterId’: 1989, ‘ValueId’: ‘0’, ‘Parameter’: ‘Part Status’, ‘Value’: ‘Active’}]

Request a Quote