This Intel-produced 5CSEMA5F31C6N part is a component in the Cyclone® V SE category, specifically engineered to be a System On Chip (SoC) device providing superior efficiency and functionality. Arriving in a tray, this chip is carefully encapsulated in a 896-Ball Grid Array (BGA) package with a standard, easy-to-handle footprint. It supports an operating temperature range from 0°C up to 85°C (Junction Temperature), facilitating reliable performance for your high-temperature, high-demand applications.

The Cyclone® V SE series demonstrates Intel’s commitment to innovation and technological advancements, delivering high-density features in a low-power FPGA. This chip consists of a multitude of on-die peripherals, potentially integrating diverse functionalities. Being a part of the Cyclone® V SE series, this 5CSEMA5F31C6N device comes with an optimized logic element (LE) structure offering increased efficiency.

Engineered to meet your demanding workload, its advanced system-level integration eliminates the need for certain external components, simplifying the overall system design with great dynamic power optimization.

The 5CSEMA5F31C6N active part number, dons an environment-friendly tag, adhering strictly to RoHScompliance standards. This chip is well-recognized for its performance in various industries such as automated industrial systems, wireless communication, and consumer electronics, representing a flexible solution for the ever-evolving integrated circuit designs. The 5CSEMA5F31C6N part provides unparalleled computing capabilities making it an excellent choice for your high-performance system design needs.