The Intel 5CSEBA6U19A7N is a highly effective System On Chip (SoC) from the reputable Cyclone® V SE series. This component embodies the high technical standards associated with the Automotive, AEC-Q100 classification, ensuring suitability for a variety of demanding applications.

Notably, the 5CSEBA6U19A7N is encapsulated in a 484-FBGA (Fine-Pitch Ball Grid Array) Package/Case. This dense packaging technology is designed to allow more interconnects, making it appropriate for high-speed, high-density applications. Intel has further streamlined this SoC by using a 484-UBGA (19×19) supplier device package offering enhanced routing and thermal performance.

The component offers a wide operating temperature range, from -40°C to 125°C (TJ), lending to its versatility across applications. Whether you’re utilizing it for advanced driver-assistance systems (ADAS), automotive infotainment, or other automotive applications, it provides reliable and consistent performance across diverse temperature environments.

The 5CSEBA6U19A7N part is currently flagged as active. This indicates that Intel continues to manufacture, support, and uphold an ongoing commitment to this SoC’s quality, relevance, and future applicability.

The item comes in a tray packaging specification. These trays are designed for automated assembly processes and for safe chip transportation, endorsing its use in larger manufacturing settings.

Intel’s 5CSEBA6U19A7N truly exemplifies the convergence of aesthetics, packaging innovation, and technical harmony, making it a crucial piece for present and future semiconductor assemblies.