The 5CSEBA5U23C8N is an exquisite System On Chip (SoC) courtesy of the industry-leading manufacturer, Intel. As part of the influential Cyclone® V SE series, this powerful SoC features top-flight architecture that proves indispensable in a diverse array of applications. Encased within a robust 672-FBGA package, the chip ensures reliable performance under varying operational conditions with an operating temperature range of 0°C to 85°C (TJ).

The packaging for the 5CSEBA5U23C8N comes in a sturdily built tray, further supplementing the chip’s resilience against external factors. The supplier device package is a 672-UBGA (23×23), meticulously designed to accommodate easy assembly and integration within a circuit. With its lofty stature as an ‘Active’ status product under Intel’s offerings, it stands to testify of the significant performance efficiency it delivers.

Key Features include:
– Series: Cyclone® V SE
– Package / Case: 672-FBGA
– Operating Temperature: 0°C ~ 85°C (TJ)
– Supplier Device Package: 672-UBGA (23×23)
– Status: Active
– Packaging: Tray

From low-end applications like simple user interfaces to more complex tasks such as server data operations, the 5CSEBA5U23C8N proves remarkably versatile. Confirmation of the product’s ingenuity can be seen in its extensive use across various industries including telecommunications, industrial automation, automotive sectors, and several others which require high-speed, high-accuracy data processing. The Intel 5CSEBA5U23C8N remains a testament to Intel’s commitment to developing high-performance, long-lasting System On Chip (SoC) products.