Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
IC SOC CORTEX-A9 700MHZ 672UBGA
$308.08
The 5CSEBA5U23A7N, a highly efficient System on Chip (SoC), is a product of esteemed semiconductor manufacturer, Intel. It is a part of the Automotive, AEC-Q100, Cyclone® V SE series, renowned for its high-level performance and reliability. With an active part status, its quality is assured, playing an integral role for proficient IC and semiconductor customers.
This SoC is nicely packaged in a 672-FBGA (Fine Pitch Ball Grid Array) package, and further supplied in a 672-UBGA (Ultra Ball Grid Array), occupying an area of 23×23. This compact design facilitates its easy integration into advanced semiconductor systems while maintaining a clean, organized circuit layout. The compactness does not compromise its extended performance range, functioning efficiently at an operating temperature ranging from -40°C to 125°C (TJ).
Given its robust versatility, the 5CSEBA5U23A7N part is particularly relevant in the automotive industry, where high precision, reliability, and long-term performance are required. Other sectors like heavy machinery, aerospace, and defense technologies, which require components with high-stress tolerance, also find this part quite useful. Its AEC-Q100 qualification attests to its robustness and reliability, even after prolonged exposure to harsh environments.
Designed by Intel, one of the pioneers in the industry, the 5CSEBA5U23A7N offers superior performance, reliability, and durability, making it fitting for varied industrial applications. It encapsulates Intel’s commitment to building high-quality SoC’s that can handle high-performance demands, even under extreme conditions. This component extends these same benefits to applications in other stress-intensive industries. A truly exceptional element that reflects the blending of modern design with reliable technology.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 672-FBGA |
Speed | 700MHz |
RAM Size | 64KB |
Operating Temperature | -40°C ~ 125°C (TJ) |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Primary Attributes | FPGA - 85K Logic Elements |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Peripherals | DMA, POR, WDT |
Supplier Device Package | 672-UBGA (23x23) |
Architecture | MCU, FPGA |
Flash Size | - |
Part Status | Active |
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