The 10AS027H3F34I2LG, manufactured by Intel, falls under the category of System On Chip (SoC) components. It belongs to the Arria 10 SX series, highly acknowledged for their finite processing capabilities. This active component is known for its remarkable robustness, with an operating temperature ranging from -40°C to 100°C (TJ), demonstrating its applicability in various temperature-dependent environments.

In terms of its physical attributes, the 10AS027H3F34I2LG is presented in a 1152-BBGA, FCBGA Package/Case. The supplier device package is a 1152-FBGA, FC (35×35), complementing its size and positioning requirements efficiently. The component is tray packaged, making it suitable for bulk handling while ensuring the protection of individual parts.

The Arria 10 SX series is widely used in several leading-edge technologies and industry applications. These industries include data centers, networking, wireless, military and defense, and medical sectors, laying testament to the component’s defined reliability and performance metrics. Its credible design and architecture ensure high-speed data processing and reduced power consumption, making it fit seamlessly into today’s technology-driven landscape.

Built with precision and Intel’s high-tech manufacturing processes, the 10AS027H3F34I2LG stands as an optimal choice for professionals seeking high-performance and quality in their integrated electronic designs. With its robust technical specifications, it is set to offer a high degree of reliability and efficiency.