The MC13892DJVLR2, sourced from NXP USA Inc., is a high-performing component falling into the specialized category. This device comes packaged in Tape & Reel (TR), making it suitable for automated assembly processes. It is housed in a 186-LFBGA package, also known as a 186-PBGA (12×12), which supports surface mount technology (SMT) for efficient and reliable integration onto printed circuit boards (PCBs).

Operating across a wide temperature range from -40°C to 85°C, the MC13892DJVLR2 ensures robust performance in various environmental conditions. Such versatility makes it an ideal selection for applications where temperature fluctuations could present a challenge.

The active status of this part signifies its availability and relevance for current and emerging technology projects. Although the series is not specified, the information provided exhibits that this component fits into critical roles within electronic systems requiring precise and dependable specialized functionalities.

Given its specifications, this component is typically leveraged in complex electronic systems across a wide array of industries, including but not limited to, telecommunications, computing, industrial, and possibly automotive, where high reliability and performance are paramount. The technical profile of the MC13892DJVLR2 underscores its significance in designs where a compact, efficient, and highly reliable solution is crucial for the success of sophisticated electronic assemblies.