The NXP USA Inc. MC13892DJVL is a specialized component designed for high-performance applications requiring robust feature sets for power management. Packaged in a 186-LFBGA format, this surface mount device is engineered to offer reliable operation in environments with operating temperatures ranging from -40°C to 85°C. With its compact 186-PBGA (12×12) supplier device package, it ensures a minimal footprint on PCBs, catering to space-conscious designs.

Although this component has been classified as obsolete, its performance characteristics make it sought after in specific legacy or maintenance projects where replacement with the exact specifications is crucial. Ideal for a wide range of applications, including but not limited to, automotive, industrial control systems, and consumer electronics, the MC13892DJVL highlights NXP’s commitment to supporting diverse industry needs.

Given its specialized nature, the MC13892DJVL caters to a niche segment of projects requiring stringent power management capabilities combined with the reliability of surface mount technology packaging. The device’s versatility and operating temperature range underscore its suitability for environments demanding high reliability and consistent performance under varying conditions.