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DS34T108GN+

IC TDM 484HSBGA

Manufacturer:

$169.80

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The DS34T108GN+ by Analog Devices Inc. stands as a specialized integrated circuit categorized within their portfolio of specialized ICs. Housed in a robust 484-BGA (Ball Grid Array) exposed pad package, this component is designed to meet the rigorous demands of surface mount technology applications. The packaging ensures reliable connection to printed circuit boards, with a supplier device package specification of 484-PBGA-HS measuring 23×23 mm, facilitating efficient heat dissipation and signal integrity.

This particular part is not recommended for new designs, indicating its suitability for existing systems or applications where replacement or compatibility with earlier technologies is critical. Engineers and procurement specialists in fields such as telecommunications, industrial control systems, and advanced computing infrastructure may find this component especially relevant due to its specialized functionality and performance characteristics.

The DS34T108GN+ exemplifies Analog Devices Inc.’s commitment to delivering high-quality and reliable components for sophisticated electronic assemblies. While the specific series information is not provided, this part’s construction and specifications underline its applicability in scenarios demanding precise, high-performance specialized IC solutions.

Mounting via surface mount technology, it ensures a sleek, space-saving integration into various electronic assemblies, underlining its suitability for intricate designs where space and reliability are paramount. The usage of such a component by experts in the field underscores the necessity for components that not only meet but exceed the stringent requirements of advanced electronic systems.

Additional information

Additional Information

Series:
RoHS Status: ROHS3 Compliant
Manufacturer Lead Time: 24 week(s)
Product Status: Not For New Designs
Packaging: Tray

Datasheet:

Download Free CAD Model:

Technical Details:
PackagingTray
Package / Case484-BGA Exposed Pad
Mounting TypeSurface Mount
TypeTDM (Time Division Multiplexing)
ApplicationsData Transport
Supplier Device Package484-PBGA-HS (23x23)
Part StatusNot For New Designs
ProgrammableNot Verified
[{‘ParameterId’: 7, ‘ValueId’: ’17’, ‘Parameter’: ‘Packaging’, ‘Value’: ‘Tray’}, {‘ParameterId’: 16, ‘ValueId’: ‘225516’, ‘Parameter’: ‘Package / Case’, ‘Value’: ‘484-BGA Exposed Pad’}, {‘ParameterId’: 69, ‘ValueId’: ‘409393’, ‘Parameter’: ‘Mounting Type’, ‘Value’: ‘Surface Mount’}, {‘ParameterId’: 183, ‘ValueId’: ‘410675’, ‘Parameter’: ‘Type’, ‘Value’: ‘TDM (Time Division Multiplexing)’}, {‘ParameterId’: 405, ‘ValueId’: ‘337272’, ‘Parameter’: ‘Applications’, ‘Value’: ‘Data Transport’}, {‘ParameterId’: 1291, ‘ValueId’: ‘576355’, ‘Parameter’: ‘Supplier Device Package’, ‘Value’: ‘484-PBGA-HS (23×23)’}, {‘ParameterId’: 1989, ‘ValueId’: ‘7’, ‘Parameter’: ‘Part Status’, ‘Value’: ‘Not For New Designs’}, {‘ParameterId’: 2697, ‘ValueId’: ‘750491’, ‘Parameter’: ‘Digi-Key Programmable’, ‘Value’: ‘Not Verified’}]

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