The MPC860SRZQ50D4 is a high-performance microprocessor developed by NXP USA Inc., belonging to the renowned MPC8xx series. This component is tailored for advanced computing needs, offering a robust solution for a wide array of applications. Its architecture is designed for efficient multitasking and high-speed processing, making it a cornerstone for systems requiring reliable and fast operations.

Key specifications of the MPC860SRZQ50D4 include:
– Packaging in a tray format, ensuring product integrity during shipping and handling.
– Utilizes a 357-BBGA (Ball Grid Array) for its package/case, designed for surface mount technology, facilitating higher density in circuit designs.
– Optimal operating temperature range from 0°C to 95°C (TA), catering to a wide range of environmental conditions.
– The device comes in a 357-PBGA (25×25) supplier device package, providing a compact footprint while allowing efficient heat dissipation.

Although now designated as obsolete, the MPC860SRZQ50D4 microprocessor remains a pivotal choice for developers and engineers in industries such as telecommunications, networking, and industrial control systems. Its robust feature set and reliability have paved the way for its adoption in sophisticated environments demanding precise and consistent performance.

Key Features:
– High-performance microprocessor within the MPC8xx series.
– Designed for surface mount technology with a 357-BBGA package.
– Operates effectively across a wide temperature range (0°C ~ 95°C).
– Ideal for applications in telecommunications, networking, and industrial controls.

The MPC860SRZQ50D4 continues to be a relevant component despite its obsolescence, showcasing NXP USA Inc.’s commitment to quality and performance in the microprocessor domain.