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MPC860ENZQ50D4R2

IC MPU MPC8XX 50MHZ 357BGA

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$129.34

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The MPC860ENZQ50D4R2 is a high-performance microprocessor from NXP USA Inc., belonging to the reputable MPC8xx series, designed for surface mounting on printed circuit boards. Presented in a 357-BBGA (Ball Grid Array) package, this component assures robust reliability and efficient thermal management. It is specifically packaged in Tape & Reel (TR) format facilitating automated assembly processes, reflecting its optimal design for volume production environments.

Engineered to operate within a broad temperature range of 0°C to 95°C (TA), the MPC860ENZQ50D4R2 ensures consistent performance in varying environmental conditions, making it an invaluable asset in critical applications. The device is encased in a 357-PBGA (25×25) package, which not only simplifies PCB design but also augments electrical performance due to its minimized inductance on signal paths.

Though tagged as obsolete, the legacy and utility of the MPC860ENZQ50D4R2 microprocessor span across various technology-driven industries, including but not limited to telecommunications, networking, and industrial control systems. Its architecture and speed cater to sophisticated computational needs, enabling integration into systems requiring a blend of high-speed processing, durability, and reliability.

NXP USA Inc.’s commitment to innovation is exemplified in the MPC860ENZQ50D4R2, combining functionality with flexibility, thereby supporting a myriad of applications. Its design and technical specifications solidify its position as a noteworthy component within the microprocessor category, underlining its significances in advancing digital solutions.

Additional information

Additional Information

Series: MPC8xx
RoHS Status: RoHS non-compliant
Manufacturer Lead Time: No lead time information available
Product Status: Obsolete
Packaging: Tape & Reel (TR)

Datasheet:

Download Free CAD Model:

Technical Details:
PackagingTape & Reel (TR)
Package / Case357-BBGA
Mounting TypeSurface Mount
Speed50MHz
Operating Temperature0°C ~ 95°C (TA)
Core ProcessorMPC8xx
Voltage - I/O3.3V
Supplier Device Package357-PBGA (25x25)
Ethernet10Mbps (4)
USB-
Number of Cores/Bus Width1 Core, 32-Bit
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Security Features-
SATA-
Part StatusObsolete
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