You are here:
  1. Home
  2. Shop
  3. Microprocessors
  4. MPC860ENCZQ66D4
  • MPC860ENCZQ66D4

MPC860ENCZQ66D4

IC MPU MPC8XX 66MHZ 357BGA

Manufacturer:

$141.53

Categories:

The MPC860ENCZQ66D4, developed by NXP USA Inc., belongs to the esteemed MPC8xx series renowned for its robust performance in microprocessor applications. This device is encased in a 357-BBGA (Ball Grid Array) package, designed for surface mount technology, which facilitates a compact design and efficient connectivity in complex circuits.

With an operational temperature range of -40°C to 95°C, the MPC860ENCZQ66D4 ensures reliability and consistent performance under extreme conditions, making it a suitable choice for applications demanding high reliability and endurance. The component’s package is a 357-PBGA measuring 25x25mm, highlighting its design for optimized space utilization in densely packed electronic assemblies.

Though marked as obsolete, the MPC860ENCZQ66D4 has been a preferred choice in various industries due to its processing power and flexibility. This microprocessor has predominantly been used in networking and communication infrastructure, automotive systems, and industrial control applications. Its architecture and capabilities have made it integral in the development of systems requiring precise processing and control functionalities.

This device, leveraging the acclaimed MPC8xx series’ legacy, embodies a solution designed to meet complex computational needs while ensuring stability and efficiency in demanding operational environments.

Additional information

Additional Information

Series: MPC8xx
RoHS Status: RoHS non-compliant
Manufacturer Lead Time: No lead time information available
Product Status: Obsolete
Packaging: Tray

Datasheet:

Download Free CAD Model:

Technical Details:
PackagingTray
Package / Case357-BBGA
Mounting TypeSurface Mount
Speed66MHz
Operating Temperature-40°C ~ 95°C (TA)
Core ProcessorMPC8xx
Voltage - I/O3.3V
Supplier Device Package357-PBGA (25x25)
Ethernet10Mbps (4)
USB-
Number of Cores/Bus Width1 Core, 32-Bit
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Security Features-
SATA-
Part StatusObsolete
[{‘ParameterId’: 7, ‘ValueId’: ’17’, ‘Parameter’: ‘Packaging’, ‘Value’: ‘Tray’}, {‘ParameterId’: 16, ‘ValueId’: ‘193709’, ‘Parameter’: ‘Package / Case’, ‘Value’: ‘357-BBGA’}, {‘ParameterId’: 69, ‘ValueId’: ‘409393’, ‘Parameter’: ‘Mounting Type’, ‘Value’: ‘Surface Mount’}, {‘ParameterId’: 143, ‘ValueId’: ‘263866’, ‘Parameter’: ‘Speed’, ‘Value’: ’66MHz’}, {‘ParameterId’: 252, ‘ValueId’: ‘212645’, ‘Parameter’: ‘Operating Temperature’, ‘Value’: ‘-40°C ~ 95°C (TA)’}, {‘ParameterId’: 506, ‘ValueId’: ‘377521’, ‘Parameter’: ‘Core Processor’, ‘Value’: ‘MPC8xx’}, {‘ParameterId’: 694, ‘ValueId’: ‘174115’, ‘Parameter’: ‘Voltage – I/O’, ‘Value’: ‘3.3V’}, {‘ParameterId’: 1291, ‘ValueId’: ‘193730’, ‘Parameter’: ‘Supplier Device Package’, ‘Value’: ‘357-PBGA (25×25)’}, {‘ParameterId’: 1576, ‘ValueId’: ‘73649’, ‘Parameter’: ‘Ethernet’, ‘Value’: ’10Mbps (4)’}, {‘ParameterId’: 1577, ‘ValueId’: ‘1’, ‘Parameter’: ‘USB’, ‘Value’: ‘-‘}, {‘ParameterId’: 1765, ‘ValueId’: ‘40128’, ‘Parameter’: ‘Number of Cores/Bus Width’, ‘Value’: ‘1 Core, 32-Bit’}, {‘ParameterId’: 1766, ‘ValueId’: ‘332441’, ‘Parameter’: ‘Co-Processors/DSP’, ‘Value’: ‘Communications; CPM’}, {‘ParameterId’: 1767, ‘ValueId’: ‘340573’, ‘Parameter’: ‘RAM Controllers’, ‘Value’: ‘DRAM’}, {‘ParameterId’: 1768, ‘ValueId’: ‘380240’, ‘Parameter’: ‘Graphics Acceleration’, ‘Value’: ‘No’}, {‘ParameterId’: 1769, ‘ValueId’: ‘1’, ‘Parameter’: ‘Display & Interface Controllers’, ‘Value’: ‘-‘}, {‘ParameterId’: 1770, ‘ValueId’: ‘1’, ‘Parameter’: ‘Security Features’, ‘Value’: ‘-‘}, {‘ParameterId’: 1771, ‘ValueId’: ‘1’, ‘Parameter’: ‘SATA’, ‘Value’: ‘-‘}, {‘ParameterId’: 1989, ‘ValueId’: ‘1’, ‘Parameter’: ‘Part Status’, ‘Value’: ‘Obsolete’}]

Request a Quote

Virtex UltraScale+

,

Xilinx’s Virtex UltraScale+ platform is shaping the future of high-performance computing. This cutting-edge field-programmable gate array (FPGA) technology enables rapid innovation in emerging applications requiring…

Read more