Analog Devices Amplifiers
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IC MPU MPC83XX 533MHZ 740TBGA
$156.95
The MPC8360CVVAJDG is a high-performance microprocessor crafted by NXP USA Inc., renowned for its cutting-edge solutions in the realm of microprocessors. As part of the esteemed MPC83xx series, this component boasts powerful processing capabilities tailored for advanced computing needs. It comes securely packaged in a tray, ensuring safe handling and delivery.
Designed with a 740-LBGA (Land Grid Array) package, this microprocessor offers a compact footprint while allowing for efficient thermal management and connectivity in a diverse array of applications. The surface mount design of the MPC8360CVVAJDG facilitates streamlined integration into system designs, making it a versatile choice for engineers and designers alike.
Operational across a wide temperature range of -40°C to 105°C (TA), this microprocessor guarantees reliability and performance even under extreme conditions, making it suitable for deployment in environments that demand unwavering operation. The device is encapsulated in a 740-TBGA (37.5mm x 37.5mm) package, providing a balance between physical robustness and high-density interconnectivity.
Despite its status as an obsolete part, the MPC8360CVVAJDG continues to be a valuable asset for legacy systems and applications that rely on the proven performance of the MPC83xx series. Its applications span across various industries, including telecommunications, networking, and industrial control systems, where reliability and processing power are paramount.
In summary, the MPC8360CVVAJDG from NXP USA Inc. stands as a testament to the enduring legacy of the MPC83xx series, offering robust processing capabilities and adaptability for specialized applications requiring high reliability and extended operational temperatures.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 740-LBGA |
Mounting Type | Surface Mount |
Speed | 533MHz |
Operating Temperature | -40°C ~ 105°C (TA) |
Core Processor | PowerPC e300 |
Voltage - I/O | 1.8V, 2.5V, 3.3V |
Supplier Device Package | 740-TBGA (37.5x37.5) |
Ethernet | 10/100/1000Mbps (1) |
USB | USB 1.x (1) |
Number of Cores/Bus Width | 1 Core, 32-Bit |
Co-Processors/DSP | Communications; QUICC Engine |
RAM Controllers | DDR, DDR2 |
Graphics Acceleration | No |
Display & Interface Controllers | - |
Security Features | - |
SATA | - |
Part Status | Obsolete |
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