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MPC8358CVRAGDDA

IC MPU MPC83XX 400MHZ 668BGA

Manufacturer:

$113.65

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The NXP USA Inc. MPC8358CVRAGDDA is a high-performance microprocessor engineered as part of the renowned MPC83xx series. This component is meticulously assembled in a 668-PBGA exposed pad package, suitable for surface mount technology (SMT) applications, ensuring robust and reliable attachment to circuit boards. It comes packaged in trays, designed to safeguard the integrity of each microprocessor during transportation and handling.

Key features of the MPC8358CVRAGDDA include its operating temperature range of -40°C to 105°C (TA), allowing for deployment in environments that demand high thermal resilience. The microprocessor’s package is defined as 668-PBGA-PGE (29×29), indicative of its footprint and pin configuration, which facilitates efficient layout on a variety of PCBs.

The part remains active in NXP’s product line-up, reflecting its ongoing relevance and demand in the market. With its robust design and advanced features, the MPC8358CVRAGDDA is extensively utilized across a wide range of industries including telecommunications, networking, and industrial applications where processing power, reliability, and extended temperature range are critical.

Key Specifications:
– **Manufacturer:** NXP USA Inc.
– **Part Number:** MPC8358CVRAGDDA
– **Series:** MPC83xx
– **Category:** Microprocessors
– **Packaging:** Tray
– **Package / Case:** 668-BBGA Exposed Pad
– **Mounting Type:** Surface Mount
– **Operating Temperature:** -40°C ~ 105°C (TA)
– **Supplier Device Package:** 668-PBGA-PGE (29×29)
– **Part Status:** Active

Professionals in the fields of telecommunications, networking, and industrial automation can rely on the MPC8358CVRAGDDA for its exceptional performance and adaptability under varying environmental conditions.

Additional information

Additional Information

Series: MPC83xx
RoHS Status: ROHS3 Compliant
Manufacturer Lead Time: 52 week(s)
Product Status: Active
Packaging: Tray

Datasheet:

Download Free CAD Model:

Technical Details:
PackagingTray
Package / Case668-BBGA Exposed Pad
Mounting TypeSurface Mount
Speed400MHz
Operating Temperature-40°C ~ 105°C (TA)
Core ProcessorPowerPC e300
Voltage - I/O1.8V, 2.5V, 3.3V
Supplier Device Package668-PBGA-PGE (29x29)
Ethernet10/100/1000Mbps (1)
USBUSB 1.x (1)
Number of Cores/Bus Width1 Core, 32-Bit
Co-Processors/DSPCommunications; QUICC Engine
RAM ControllersDDR, DDR2
Graphics AccelerationNo
Display & Interface Controllers-
Security Features-
SATA-
Part StatusActive
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