The NXP USA Inc. MPC8260AZUPJDB, part of the prestigious MPC82xx series, remains at the forefront of microprocessor technology, offering unparalleled functionality for advanced applications. This component, packaged in a robust 480-LBGA Exposed Pad format, is tailored for surface mount technology, ensuring seamless integration into a wide range of electronic assemblies.

Boasting an expansive operating temperature range from 0°C to 105°C (TA), this microprocessor is designed to maintain optimal performance under varying environmental conditions, making it an ideal choice for high-reliability applications across multiple industries, including telecommunications, automotive, and industrial control systems. The device’s package dimensions are detailed as a 480-TBGA (37.5×37.5), ensuring a compact footprint while offering the high pin count required for complex circuit designs.

The MPC8260AZUPJDB’s status as an active part underscores NXP’s commitment to ongoing support and availability, making it a reliable choice for both current and future projects requiring high-performance data processing and control. As part of NXP’s distinguished MPC82xx series, this microprocessor is engineered to deliver exceptional computational efficiency and connectivity, facilitating the development of sophisticated systems that demand high-speed data processing and versatile peripheral integration.

Overall, the NXP MPC8260AZUPJDB microprocessor exemplifies cutting-edge technology for critical applications where reliability, durability, and high performance are paramount. Its integration capabilities and robust design make it a fundamental component for engineers and professionals aiming to push the boundaries of innovation in their respective fields.