The MPC8241LVR200D, crafted by the renowned NXP USA Inc., is a pivotal component in the microprocessor category belonging to the distinguished MPC82xx series. This advanced microprocessor is meticulously packaged in a tray, underscored by its utilization of a 357-BBGA package/case. Designed for surface mount applications, it demands precision in manufacturing and integration into sophisticated systems.

Specifications include:
– Package / Case: 357-BBGA, facilitating efficient thermal management and connectivity.
– Mounting Type: Surface Mount, ensuring compatibility with modern PCB technologies.
– Operating Temperature Range: 0°C to 105°C (TA), offering resilience in varied environmental conditions.
– Supplier Device Package: 357-PBGA (25×25), indicating a robust design for reliable operation.

The MPC8241LVR200D, now classified as obsolete, has historically been instrumental in driving advancements across several industries, such as telecommunications, computing, and in the realms of high-performance embedded applications. Its ability to function in a wide range of operating temperatures makes it versatile for diverse engineering challenges.

Key attributes include:
– Advanced processing capabilities within the MPC82xx series lineage.
– High reliability and compatibility with surface mount technology.
– Broad operating temperature spectrum catering to rigorous demands.

The MPC8241LVR200D represents NXP USA Inc.’s commitment to developing microprocessors that meet the evolving needs of technology sectors, emphasizing high performance, reliability, and integration ease. Despite its obsolescence, its legacy in empowering critical applications across various industries remains impactful.