Analog Devices Amplifiers
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The FC80960HA33SL2GV is a high-performance microprocessor from Intel, belonging to the distinguished i960 series. This component is packaged in a 208-QFP (Quad Flat Package), specifically designed for surface mount technology, ensuring a streamlined assembly process on printed circuit boards. With an operating temperature range of 0°C to 85°C (Tc), it is engineered to maintain reliability across various thermal environments.
Characterized by its obsolescence, this microprocessor has left a notable legacy in the development of embedded applications, particularly in sectors such as industrial control systems, automotive electronics, and sophisticated communications equipment. The 208-PQFP package not only aids in efficient heat dissipation but also contributes to the miniaturization of electronic assemblies, allowing for more compact and efficient designs.
The FC80960HA33SL2GV operates seamlessly within the specified temperature range, underlining its suitability for challenging and temperature-sensitive applications. This Intel i960 series microprocessor is a testament to Intel’s commitment to delivering high-performance computing solutions that have historically supported the advancement of technology across critical industries. Although now classified as obsolete, its presence in legacy systems underscores its lasting impact and engineering excellence.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 208-QFP |
Mounting Type | Surface Mount |
Speed | 33MHz |
Operating Temperature | 0°C ~ 85°C (TC) |
Core Processor | i960 |
Voltage - I/O | 3.3V |
Supplier Device Package | 208-PQFP |
Ethernet | - |
USB | - |
Number of Cores/Bus Width | 1 Core, 32-Bit |
Co-Processors/DSP | - |
RAM Controllers | DRAM |
Graphics Acceleration | No |
Display & Interface Controllers | - |
Security Features | - |
SATA | - |
Part Status | Obsolete |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
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DICE (WAFER SAWN) - WAFFLE PACK
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TSSOP / 16 / 5X4MM-0
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