You are here:
  1. Home
  2. Shop
  3. Microcontrollers
  4. MC9S08AC60CFGER
  • MC9S08AC60CFGER

MC9S08AC60CFGER

IC MCU 8BIT 60KB FLASH 44LQFP

Manufacturer:

$5.51

Categories:

The NXP USA Inc. MC9S08AC60CFGER belongs to the S08 series of microcontrollers, encapsulated in a 44-LQFP package with dimensions of 10×10. This component, characterized by its surface mount mounting type, is designed to operate within a temperature range of -40°C to 85°C, accommodating a wide range of environmental conditions. Suitable for use in systems requiring a voltage supply between 2.7V and 5.5V, this microcontroller ensures adaptability to various power configurations.

With an active part status, the MC9S08AC60CFGER features 34 I/O pins, providing a versatile interface capable of supporting a multitude of peripheral connections. This extensive number of I/O options enhances its utility in complex electronic systems. Housed in tape & reel (TR) packaging, this microcontroller is optimized for efficient assembly processes, promoting both ease of manufacturing and integration into various applications.

The S08 series microcontroller is well-suited for a broad spectrum of industry applications, including but not limited to automotive electronics, industrial control systems, and consumer electronics, demonstrating its flexibility and reliability in handling diverse operational demands.

Additional information

Additional Information

Series: S08
RoHS Status: ROHS3 Compliant
Manufacturer Lead Time: 26 week(s)
Product Status: Active
Packaging: Tape & Reel (TR)

Datasheet:

Download Free CAD Model:

Technical Details:
PackagingTape & Reel (TR)
Package / Case44-LQFP
Mounting TypeSurface Mount
Speed40MHz
Program Memory Size60KB (60K x 8)
RAM Size2K x 8
Operating Temperature-40°C ~ 85°C (TA)
Oscillator TypeInternal
Program Memory TypeFLASH
EEPROM Size-
Core ProcessorS08
Data ConvertersA/D 8x10b
Core Size8-Bit
Voltage - Supply (Vcc/Vdd)2.7V ~ 5.5V
ConnectivityI²C, SCI, SPI
PeripheralsLVD, POR, PWM, WDT
Supplier Device Package44-LQFP (10x10)
Part StatusActive
Number of I/O34
ProgrammableNot Verified
[{‘ParameterId’: 7, ‘ValueId’: ‘1’, ‘Parameter’: ‘Packaging’, ‘Value’: ‘Tape & Reel (TR)’}, {‘ParameterId’: 16, ‘ValueId’: ‘220340’, ‘Parameter’: ‘Package / Case’, ‘Value’: ’44-LQFP’}, {‘ParameterId’: 69, ‘ValueId’: ‘409393’, ‘Parameter’: ‘Mounting Type’, ‘Value’: ‘Surface Mount’}, {‘ParameterId’: 143, ‘ValueId’: ‘214890’, ‘Parameter’: ‘Speed’, ‘Value’: ’40MHz’}, {‘ParameterId’: 155, ‘ValueId’: ‘257282’, ‘Parameter’: ‘Program Memory Size’, ‘Value’: ’60KB (60K x 8)’}, {‘ParameterId’: 156, ‘ValueId’: ‘168098’, ‘Parameter’: ‘RAM Size’, ‘Value’: ‘2K x 8’}, {‘ParameterId’: 252, ‘ValueId’: ‘212621’, ‘Parameter’: ‘Operating Temperature’, ‘Value’: ‘-40°C ~ 85°C (TA)’}, {‘ParameterId’: 283, ‘ValueId’: ‘359690’, ‘Parameter’: ‘Oscillator Type’, ‘Value’: ‘Internal’}, {‘ParameterId’: 290, ‘ValueId’: ‘347758’, ‘Parameter’: ‘Program Memory Type’, ‘Value’: ‘FLASH’}, {‘ParameterId’: 291, ‘ValueId’: ‘1’, ‘Parameter’: ‘EEPROM Size’, ‘Value’: ‘-‘}, {‘ParameterId’: 506, ‘ValueId’: ‘399476’, ‘Parameter’: ‘Core Processor’, ‘Value’: ‘S08’}, {‘ParameterId’: 519, ‘ValueId’: ‘306519’, ‘Parameter’: ‘Data Converters’, ‘Value’: ‘A/D 8x10b’}, {‘ParameterId’: 689, ‘ValueId’: ‘293889’, ‘Parameter’: ‘Core Size’, ‘Value’: ‘8-Bit’}, {‘ParameterId’: 1112, ‘ValueId’: ‘134947’, ‘Parameter’: ‘Voltage – Supply (Vcc/Vdd)’, ‘Value’: ‘2.7V ~ 5.5V’}, {‘ParameterId’: 1113, ‘ValueId’: ‘357216’, ‘Parameter’: ‘Connectivity’, ‘Value’: ‘I²C, SCI, SPI’}, {‘ParameterId’: 1114, ‘ValueId’: ‘369713’, ‘Parameter’: ‘Peripherals’, ‘Value’: ‘LVD, POR, PWM, WDT’}, {‘ParameterId’: 1291, ‘ValueId’: ‘220341’, ‘Parameter’: ‘Supplier Device Package’, ‘Value’: ’44-LQFP (10×10)’}, {‘ParameterId’: 1989, ‘ValueId’: ‘0’, ‘Parameter’: ‘Part Status’, ‘Value’: ‘Active’}, {‘ParameterId’: 2208, ‘ValueId’: ’34’, ‘Parameter’: ‘Number of I/O’, ‘Value’: ’34’}, {‘ParameterId’: 2697, ‘ValueId’: ‘750491’, ‘Parameter’: ‘Digi-Key Programmable’, ‘Value’: ‘Not Verified’}]

Request a Quote

Virtex UltraScale+

,

Xilinx’s Virtex UltraScale+ platform is shaping the future of high-performance computing. This cutting-edge field-programmable gate array (FPGA) technology enables rapid innovation in emerging applications requiring…

Read more