Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
IC MCU 32BIT 512KB FLASH 144LQFP
$15.69
The LPC4322JBD144E microcontroller by NXP USA Inc. stands out as a versatile and powerful component in the LPC43xx series, tailored for demanding applications requiring robust control and connectivity options. This microcontroller incorporates a range of high-performance features designed to meet the sophisticated requirements of various industry sectors including automotive, industrial control, and consumer electronics.
Highlighted features of the LPC4322JBD144E include:
– Package Type: 144-LQFP, measuring 20×20, providing a compact footprint for space-constrained applications.
– Mounting Type: Surface Mount Technology, facilitating efficient assembly and integration into a wide range of product designs.
– Operating Temperature Range: Extends from -40°C to +105°C, ensuring reliable operation under extreme conditions.
– Supply Voltage Range: Supports 2.2V to 3.6V, offering flexibility in power design and compatibility with low-power applications.
– I/O Count: Boasts 83 input/output ports, enabling extensive peripheral connectivity and interface options for multifaceted design requirements.
– Active Part Status: Indicates ongoing production and support from NXP USA Inc., ensuring long-term availability and deployment in critical projects.
This microcontroller’s architecture is designed to support complex digital signal control applications, offering a balance of power efficiency and processing capability. The versatility of the LPC4322JBD144E makes it an ideal choice for developers looking to push the boundaries of automotive systems, advanced industrial automation, and consumer devices that demand high levels of integration and computational power.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 144-LQFP |
Mounting Type | Surface Mount |
Speed | 204MHz |
Program Memory Size | 512KB (512K x 8) |
RAM Size | 104K x 8 |
Operating Temperature | -40°C ~ 105°C (TA) |
Oscillator Type | Internal |
Program Memory Type | FLASH |
EEPROM Size | 16K x 8 |
Core Processor | ARM® Cortex®-M4/M0 |
Data Converters | A/D 8x10b; D/A 1x10b |
Core Size | 32-Bit Dual-Core |
Voltage - Supply (Vcc/Vdd) | 2.2V ~ 3.6V |
Connectivity | CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG |
Peripherals | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT |
Supplier Device Package | 144-LQFP (20x20) |
Part Status | Active |
Number of I/O | 83 |
Programmable | Not Verified |
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
Integrated Circuits (ICs) form the foundation of modern electronics, enabling complex functionality in compact packages. NXP, a pioneer in semiconductor technology, has a rich history…
Xilinx’s Virtex UltraScale+ platform is shaping the future of high-performance computing. This cutting-edge field-programmable gate array (FPGA) technology enables rapid innovation in emerging applications requiring…
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC MCU 32BIT 128KB FLASH 80LQFP
IC MCU 8BIT 8KB FLASH 28TSSOP
IC MCU 16BIT 60KB FLASH 64LQFP
IC MCU 16BIT 512KB FLASH 100TQFP
IC MCU 8BIT ROMLESS 44PLCC
IC MCU 16BIT 256KB FLASH 100TQFP
IC MCU 16BIT 48KB FLASH 28SOIC
IC MCU 8BIT 16KB FLASH 80TQFP
IC MCU 16BIT 32KB FLASH 44TQFP
IC MCU 8BIT 28KB FLASH 44TQFP
IC MCU 8BIT 128KB FLASH 28SSOP
IC MCU 8BIT 3.5KB FLASH 28SOIC
The Microchip USA newsletter is your free resource for industry news, MUSA updates, and education. Stay informed and up-to-date. Discover our company updates, cutting-edge articles, and enhance your skills with relevant educational content to stay ahead of the curve.
Thank you for Signing Up |