Analog Devices Amplifiers
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IC MCU 16/32B 256KB FLSH 100LQFP
$18.23
The NXP USA Inc. LPC2365FBD100,551 falls into the category of high-performance microcontrollers, designed as part of the LPC2300 series known for its exceptional efficiency and versatility. Engineered for advanced operations, this microcontroller showcases an array of features tailored for rigorous applications across various industries including automotive, industrial control, medical devices, and communication systems owing to its robust processing capabilities and extensive I/O options.
Key Specifications:
– **Manufacturer:** NXP USA Inc.
– **Series:** LPC2300
– **Package / Case:** 100-LQFP, offering a compact footprint for space-constrained applications.
– **Mounting Type:** Surface Mount, facilitating streamlined integration into a wide range of system assemblies.
– **Operating Temperature Range:** -40°C to 85°C, ensuring reliability in extreme environmental conditions.
– **Voltage – Supply (Vcc/Vdd):** 3V to 3.6V, accommodating low-power requirements.
– **Number of I/O:** 70, providing ample interfacing capabilities for complex digital and analog functions.
– **Packaging:** Supplied in a tray, optimizing preservation and handling during the manufacturing process.
– **Part Status:** Not For New Designs, indicating its suitedness for existing applications while highlighting the potential need for legacy support or consideration of future alternates in new systems design.
Despite its classification under “Not For New Designs”, the LPC2365FBD100,551 microcontroller remains a pivotal component in sustaining the operational efficiency of established applications that demand high-speed processing and multifaceted connectivity. Its adherence to industry-standard specifications further cements its utility in the continued development and maintenance of cutting-edge technology frameworks within specified operational realms.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 100-LQFP |
Mounting Type | Surface Mount |
Speed | 72MHz |
Program Memory Size | 256KB (256K x 8) |
RAM Size | 58K x 8 |
Operating Temperature | -40°C ~ 85°C (TA) |
Oscillator Type | Internal |
Program Memory Type | FLASH |
EEPROM Size | - |
Core Processor | ARM7® |
Data Converters | A/D 6x10b; D/A 1x10b |
Core Size | 16/32-Bit |
Voltage - Supply (Vcc/Vdd) | 3V ~ 3.6V |
Connectivity | Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART |
Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
Supplier Device Package | 100-LQFP (14x14) |
Part Status | Not For New Designs |
Number of I/O | 70 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
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TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
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TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
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