Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
IC MCU 16/32BIT ROMLESS 144LQFP
$11.34
The LPC2290FBD144015 is a high-performance microcontroller crafted by NXP USA Inc., belonging to the esteemed LPC2200 series. Engineered with precision, this MCU is encapsulated in a 144-LQFP (Low Quad Flat Package) with a footprint of 20x20mm, designed for surface mount technology applications, ensuring a compact yet powerful solution for a wide range of embedded systems.
Supporting a versatile operating temperature range from -40°C to 85°C, this device ensures reliable performance across extreme environmental conditions, making it an ideal choice for demanding applications in the automotive, industrial, and consumer electronics sectors. Its electrical specifications include a flexible voltage supply range from 1.65V to 3.6V, accommodating various power supply designs while optimizing power consumption.
The LPC2290FBD144015 boasts an impressive array of 76 general-purpose input/output (I/O) pins, providing immense flexibility and connectivity options for interfacing with other peripherals and devices, enhancing its utility in complex embedded designs. The device is offered in bulk packaging, allowing for efficient procurement and scalability for projects of all sizes.
With its robust feature set, including significant I/O capabilities and a broad operating temperature range, coupled with the quality and reliability associated with NXP USA Inc., this microcontroller stands as a prime solution for designers and engineers looking to push the boundaries of what’s possible in their next-generation embedded systems.
Datasheet:
Not Available
Download Free CAD Model:
Packaging | Bulk |
Package / Case | 144-LQFP |
Mounting Type | Surface Mount |
Speed | 60MHz |
Program Memory Size | - |
RAM Size | 64K x 8 |
Operating Temperature | -40°C ~ 85°C (TA) |
Oscillator Type | Internal |
Program Memory Type | ROMless |
EEPROM Size | - |
Core Processor | ARM7® |
Data Converters | A/D 8x10b |
Core Size | 16/32-Bit |
Voltage - Supply (Vcc/Vdd) | 1.65V ~ 3.6V |
Connectivity | CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART |
Peripherals | PWM, WDT |
Supplier Device Package | 144-LQFP (20x20) |
Part Status | Active |
Number of I/O | 76 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
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DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
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