Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
IC MCU 16/32BIT ROMLESS 144LQFP
$5.77
The LPC2210FBD144/01,5 microcontroller, manufactured by NXP USA Inc., is a pivotal component defined by its robust design and wide-ranging capabilities. A part of the acclaimed LPC2200 series, this microcontroller is distinguished by its integration into surface mount technology, highlighting its suitability for sophisticated, space-conscious electronic systems. Geared towards advanced applications, it caters to a demanding range of operating temperatures from -40°C to 85°C, ensuring reliability in diverse environments.
Key Specifications:
– **Manufacturer:** NXP USA Inc.
– **Category:** Microcontrollers
– **Series:** LPC2200
– **Packaging:** Delivered in a tray for secure handling and transportation.
– **Package / Case:** Utilizes a 144-LQFP format, promoting efficient space utilization and integration.
– **Mounting Type:** Optimized for surface mount applications, enabling streamlined assembly processes.
– **Operating Temperature Range:** -40°C to 85°C, designed for high-performance reliability across a broad spectrum of temperatures.
– **Voltage Supply (Vcc/Vdd):** Supports a versatile range of 1.65V to 3.6V, accommodating various power requirements.
– **Supplier Device Package:** Features a 144-LQFP (20×20) package, facilitating both compact design and robust functionality.
– **I/O Count:** Boasts 76 input/output lines, providing extensive connectivity for complex tasks.
– **Part Status:** Noted as discontinued at Digi-Key, indicating a shift towards newer or alternative solutions.
This microcontroller is extensively deployed across several industries, including but not limited to automation, telecommunications, and consumer electronics, underpinning its versatility and high demand.
By incorporating the LPC2210FBD144/01,5 into your electronic designs, you leverage a component that balances performance, power efficiency, and a wide operational temperature range, making it an ideal choice for advanced, high-density applications.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 144-LQFP |
Mounting Type | Surface Mount |
Speed | 60MHz |
Program Memory Size | - |
RAM Size | 16K x 8 |
Operating Temperature | -40°C ~ 85°C (TA) |
Oscillator Type | Internal |
Program Memory Type | ROMless |
EEPROM Size | - |
Core Processor | ARM7® |
Data Converters | A/D 8x10b |
Core Size | 16/32-Bit |
Voltage - Supply (Vcc/Vdd) | 1.65V ~ 3.6V |
Connectivity | EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART |
Peripherals | POR, PWM, WDT |
Supplier Device Package | 144-LQFP (20x20) |
Part Status | Discontinued at |
Number of I/O | 76 |
Programmable | Not Verified |
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
Integrated Circuits (ICs) form the foundation of modern electronics, enabling complex functionality in compact packages. NXP, a pioneer in semiconductor technology, has a rich history…
Xilinx’s Virtex UltraScale+ platform is shaping the future of high-performance computing. This cutting-edge field-programmable gate array (FPGA) technology enables rapid innovation in emerging applications requiring…
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC MCU 8BIT ROMLESS 40DIP
IC MCU 32BIT 128KB FLASH 64LQFP
IC MCU 8BIT 16KB FLASH 80TQFP
IC MCU 16BIT 32KB FLASH 44TQFP
IC MCU 32BIT 256KB FLASH 64QFN
IC MCU 16BIT 32KB FLASH 28SSOP
IC MCU 16BIT 256KB FLASH 48TQFP
IC MCU 8/16BIT 32KB FLASH 44VQFN
IC MCU 8BIT 7KB FLASH 14DIP
IC MCU 8BIT 32KB FLASH 48TQFP
IC MCU 8BIT 3.5KB FLASH 28SOIC
IC MCU 8BIT 14KB FLASH 14DIP
The Microchip USA newsletter is your free resource for industry news, MUSA updates, and education. Stay informed and up-to-date. Discover our company updates, cutting-edge articles, and enhance your skills with relevant educational content to stay ahead of the curve.
Thank you for Signing Up |