Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
IC MCU 16/32B 128KB FLASH 64LQFP
$12.86
The LPC2134FBD64/01,11, manufactured by NXP USA Inc., stands as a prominent member of the LPC2100 series, tailored for advanced microcontroller applications. This component is specifically designed to meet the rigorous demands of sophisticated electronic systems across various industries, including automotive, industrial automation, and consumer electronics. Engineered for high-performance operations, this microcontroller facilitates robust, efficient designs with its comprehensive feature set and specifications.
Key characteristics of the LPC2134FBD64/01,11 include:
– **Microcontroller Type**: With its powerful core, this microcontroller offers a blend of efficiency and reliability for complex applications.
– **Series**: Falling under the LPC2100 series, known for its integration and versatility in handling demanding control tasks.
– **Package/Case**: The 64-LQFP package ensures a compact footprint while allowing for a high degree of functionality within a limited space.
– **Mounting Type**: Designed for surface mount applications, facilitating streamlined manufacturing and assembly processes.
– **Operating Temperature Range**: Ensuring reliable performance in extreme conditions, this microcontroller operates effectively from -40°C to 85°C.
– **Voltage Supply**: Compatible with a 3V to 3.6V supply voltage, making it suitable for low-power operations in battery-driven devices.
– **Supplier Device Package**: Available in a 64-LQFP (10×10) configuration, offering a balance of performance and size.
– **Part Status**: Noted as “Not For New Designs,” indicating a focus on legacy systems and applications where continuity of supply and compatibility are critical.
– **Number of I/O**: Boasting 47 I/O ports, this device offers extensive connectivity options for peripheral devices and interfaces.
The LPC2134FBD64/01,11 by NXP USA Inc. is encapsulated within a tape and reel packaging, ideal for automated assembly lines, ensuring efficiency and reducing placement errors. Primarily used in sectors that demand high reliability and extended operational life, the LPC2134FBD64/01,11 microcontroller integrates seamlessly into various applications, underlining its versatility and adaptability in complex electronic environments.
Download Free CAD Model:
Packaging | Tape & Reel (TR) |
Package / Case | 64-LQFP |
Mounting Type | Surface Mount |
Speed | 60MHz |
Program Memory Size | 128KB (128K x 8) |
RAM Size | 16K x 8 |
Operating Temperature | -40°C ~ 85°C (TA) |
Oscillator Type | Internal |
Program Memory Type | FLASH |
EEPROM Size | - |
Core Processor | ARM7® |
Data Converters | A/D 16x10b; D/A 1x10b |
Core Size | 16/32-Bit |
Voltage - Supply (Vcc/Vdd) | 3V ~ 3.6V |
Connectivity | I²C, Microwire, SPI, SSI, SSP, UART/USART |
Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
Supplier Device Package | 64-LQFP (10x10) |
Part Status | Not For New Designs |
Number of I/O | 47 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
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DICE (WAFER SAWN) - WAFFLE PACK
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TSSOP / 16 / 5X4MM-0
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