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MT53E512M32D1ZW-046 AAT:B TR





The MT53E512M32D1ZW-046 AAT:B TR by Micron Technology Inc. emerges as a cutting-edge memory component designed for rigorous applications. This product falls under the category of specialized memory solutions, specifically tailored for the automotive industry, meeting the stringent AEC-Q100 standards which certify its reliability and performance under extreme conditions.

Boasting a densely packed 200-TFBGA (Ball Grid Array) package, it facilitates compact and efficient designs with its dimensions organized in a 10×14.5 layout. The surface mount technology (SMT) enables this component to be directly placed on the surface of printed circuit boards (PCBs), enhancing the overall manufacturing process by reducing production times and costs.

With its broad operating temperature range of -40°C to 105°C, this memory part demonstrates exceptional durability and functionality in environments that would compromise lesser components. It’s engineered for applications where reliability is non-negotiable, such as advanced driver assistance systems (ADAS), in-vehicle networking, and other critical automotive systems that demand high-reliability memory storage solutions.

The MT53E512M32D1ZW-046 AAT:B TR, currently marked as active, is supplied in tape and reel packaging, highlighting its readiness for automated assembly processes. This packaging type is optimal for high-volume production, ensuring the components are protected and easy to handle during the manufacturing phase.

Micron Technology Inc.’s commitment to innovation and quality is profoundly represented in this memory component, making it a quintessential choice for developers and engineers looking to leverage superior memory solutions in automotive and potentially other high-reliability industrial applications.

Additional information

Additional Information

Series: Automotive, AEC-Q100
RoHS Status: unknown
Manufacturer Lead Time: 4 week(s)
Product Status: Active
Packaging: Tape & Reel (TR)


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Technical Details:
PackagingTape & Reel (TR)
Package / Case200-TFBGA
Mounting TypeSurface Mount
Memory Size16Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V
TechnologySDRAM - Mobile LPDDR4X
Clock Frequency2.133 GHz
Memory FormatDRAM
Supplier Device Package200-TFBGA (10x14.5)
Part StatusActive
Write Cycle Time - Word, Page18ns
Memory InterfaceParallel
Access Time3.5 ns
Memory Organization512M x 32
ProgrammableNot Verified
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