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MT53E256M32D2DS-053 AAT:B TR





The MT53E256M32D2DS-053 AAT:B TR by Micron Technology Inc. represents a cutting-edge addition to the field of memory components, particularly designed to meet the stringent requirements of the automotive industry. This part falls under the AEC-Q100 series, highlighting its compliance with automotive quality standards. Featuring a capacity of 256 Megabits in a x32 configuration, it ensures optimal performance for advanced automotive applications. The device is encapsulated in a 200-ball Fine-pitch Ball Grid Array (WFBGA) package, measuring 10×14.5mm, optimized for surface mount technology, which caters to the increasing demand for compact and reliable memory solutions in space-constrained applications.

Operating over an extended temperature range of -40°C to 105°C, this memory component is designed to withstand the harsh conditions commonly encountered in automotive environments, ensuring reliability and performance. The component is offered in Tape & Reel (TR) packaging, facilitating efficient assembly processes for high-volume manufacturing. As it is marked as “Last Time Buy,” it indicates that the product is nearing the end of its production cycle, making it an essential procurement consideration for manufacturers requiring long-term supply stability for their automotive projects.

This memory component is pivotal for applications requiring high-speed data processing and robust memory storage, including advanced driver-assistance systems (ADAS), in-vehicle infotainment systems, and other critical automotive subsystems. Its technical sophistication and compliance with automotive standards make it an ideal choice for developers and manufacturers aiming to enhance the performance and reliability of their next-generation automotive technologies.

Additional information

Additional Information

Series: Automotive, AEC-Q100
RoHS Status: ROHS3 Compliant
Manufacturer Lead Time: 6 week(s)
Product Status: Last Time Buy
Packaging: Tape & Reel (TR)


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Technical Details:
PackagingTape & Reel (TR)
Package / Case200-WFBGA
Mounting TypeSurface Mount
Memory Size8Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.1V
TechnologySDRAM - Mobile LPDDR4
Clock Frequency1.866 GHz
Memory FormatDRAM
Supplier Device Package200-WFBGA (10x14.5)
Part StatusLast Time Buy
Write Cycle Time - Word, Page-
Memory Interface-
Memory Organization256M x 32
ProgrammableNot Verified
[{‘ParameterId’: 7, ‘ValueId’: ‘1’, ‘Parameter’: ‘Packaging’, ‘Value’: ‘Tape & Reel (TR)’}, {‘ParameterId’: 16, ‘ValueId’: ‘140924’, ‘Parameter’: ‘Package / Case’, ‘Value’: ‘200-WFBGA’}, {‘ParameterId’: 69, ‘ValueId’: ‘409393’, ‘Parameter’: ‘Mounting Type’, ‘Value’: ‘Surface Mount’}, {‘ParameterId’: 142, ‘ValueId’: ‘640383’, ‘Parameter’: ‘Memory Size’, ‘Value’: ‘8Gbit’}, {‘ParameterId’: 149, ‘ValueId’: ‘420134’, ‘Parameter’: ‘Memory Type’, ‘Value’: ‘Volatile’}, {‘ParameterId’: 252, ‘ValueId’: ‘212438’, ‘Parameter’: ‘Operating Temperature’, ‘Value’: ‘-40°C ~ 105°C (TC)’}, {‘ParameterId’: 276, ‘ValueId’: ‘45759’, ‘Parameter’: ‘Voltage – Supply’, ‘Value’: ‘1.1V’}, {‘ParameterId’: 570, ‘ValueId’: ‘400807’, ‘Parameter’: ‘Technology’, ‘Value’: ‘SDRAM – Mobile LPDDR4’}, {‘ParameterId’: 800, ‘ValueId’: ‘1.866 GHz’, ‘Parameter’: ‘Clock Frequency’, ‘Value’: ‘1.866 GHz’}, {‘ParameterId’: 961, ‘ValueId’: ‘340573’, ‘Parameter’: ‘Memory Format’, ‘Value’: ‘DRAM’}, {‘ParameterId’: 1291, ‘ValueId’: ‘140925’, ‘Parameter’: ‘Supplier Device Package’, ‘Value’: ‘200-WFBGA (10×14.5)’}, {‘ParameterId’: 1989, ‘ValueId’: ‘4’, ‘Parameter’: ‘Part Status’, ‘Value’: ‘Last Time Buy’}, {‘ParameterId’: 2042, ‘ValueId’: ‘1’, ‘Parameter’: ‘Write Cycle Time – Word, Page’, ‘Value’: ‘-‘}, {‘ParameterId’: 2043, ‘ValueId’: ‘1’, ‘Parameter’: ‘Memory Interface’, ‘Value’: ‘-‘}, {‘ParameterId’: 2689, ‘ValueId’: ‘720256’, ‘Parameter’: ‘Memory Organization’, ‘Value’: ‘256M x 32’}, {‘ParameterId’: 2697, ‘ValueId’: ‘750491’, ‘Parameter’: ‘Digi-Key Programmable’, ‘Value’: ‘Not Verified’}]

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