The MIC68401YML-TR by Microchip Technology is a high-performance linear component designed to meet the rigorous demands of modern electronic applications. This device is encapsulated in a 16-VQFN exposed pad package, which ensures efficient thermal dissipation and a compact footprint for space-sensitive applications. Suited for surface mount technology (SMT), the MIC68401YML-TR offers a conducive approach to high-density board designs.

Featuring an operational temperature range of -40°C to 125°C, the MIC68401YML-TR is engineered to sustain reliability and functionality under extreme temperatures, making it an ideal choice for industrial, automotive, and communications technology applications. The precision and stability of this component make it conducive to high-performance power management circuits.

Its packaging in Tape & Reel (TR) format facilitates efficient assembly processes, especially for high-volume production, enhancing the overall manufacturing throughput while reducing costs associated with manual handling.

With its active part status, the MIC68401YML-TR represents Microchip Technology’s commitment to providing long-term availability, ensuring that designers and engineers have access to critical components for both existing and future projects. The adherence to a 16-QFN (4×4) supplier device package specification further ensures compatibility with standard QFN footprint requirements, simplifying the integration process into various circuit designs.

The adoption of the MIC68401YML-TR spans across a diverse set of industries, leveraging its robust design to enhance the reliability and efficiency of systems where stable linear performance is crucial, underscoring its significance in the ever-evolving landscape of electronic component solutions.