The MAX5960LECS+, crafted by Analog Devices Inc., is a distinguished member of the hot swap controller category, designed to provide safe insertion and removal of cards from live backplanes. Housed in an efficient 80-TQFP package, this component ensures a robust and reliable operation in systems where minimal downtime is crucial. Its packaging method in trays guarantees safe handling and delivery. Suitable for surface mounting, the device seamlessly integrates into a variety of printed circuit board assemblies.

Key specifications include:

– Package/Case: 80-TQFP, offering a compact footprint for space-conscious applications.
– Mounting Type: Surface Mount, facilitating integration into modern PCB technologies.
– Operating Temperature Range: -40°C to 85°C, ensuring reliability in a wide range of environments.
– Supplier Device Package: 80-TQFP (12×12), indicating its dimensions for compatibility assessments.

Although marked as obsolete, the MAX5960LECS+ remains a vital component in legacy systems, particularly in sectors like telecommunications, data processing, and industrial automation, where hot swap functionality is essential to maintain continuous operations and minimize service interruptions.

As a testament to Analog Devices Inc.’s commitment to advancing circuit protection technologies, this hot swap controller exemplifies precision engineering, demonstrating their ongoing dedication to quality and reliability even in components that have reached their end of life.