The AMD XCVU9P-2FLGA2577I, hailing from the advanced Virtex® UltraScale+™ series, represents a pinnacle in FPGA (Field Programmable Gate Array) technology. Encased in a 2577-FCBGA (52.5×52.5) package and prepared for surface mount applications, this component is designed to endure demanding conditions, with an operating temperature range of -40°C to +100°C (TJ).

It is furnished with an impressive 2,586,150 logic elements/cells, enabling it to handle complex algorithms and processes efficiently. The component boasts 147,780 programmable logic blocks (LABs/CLBs) and holds an extensive capacity for data management, highlighted by its 391,168,000 total RAM bits. Additionally, it’s equipped with 448 I/O ports for comprehensive connectivity options.

Packaged meticulously in trays, the XCVU9P-2FLGA2577I maintains its status as an active part, ready to be deployed into a wide range of applications. It excels in sectors requiring high-speed data processing and substantial computational power, including but not limited to telecommunications, data centers, aerospace, and defense industries.

Key features include:
– Part Number: XCVU9P-2FLGA2577I
– 2577-BBGA, FCBGA packaging for robust surface mount applications
– 2,586,150 logic elements/cells for complex processing capabilities
– 147,780 LABs/CLBs offering significant programmability
– 391,168,000 total RAM bits for extensive data storage
– 448 I/O for versatile connectivity
– Operates effectively in temperatures ranging from -40°C to 100°C

This AMD Virtex® UltraScale+™ FPGA is a quintessential choice for industry professionals seeking unparalleled processing power, flexibility, and durability in high-demand environments.